Polyimide, also known as PI, refers to a type of low crystalline or amorphous polymer compound containing imide groups on the main chain. It has long occupied the top position of the polymer material pyramid and is considered one of the most promising engineering plastics in the 21st century. It is also one of the most heat-resistant chemical materials in engineering plastics. PI materials have the characteristics of high temperature resistance, low temperature resistance, excellent thermal expansion coefficient, high tensile strength, as well as advantages such as radiation resistance, flame retardancy, and biocompatibility. PI materials are mainly used in industries such as 5G communication, flexible screen display, foldable smartphones, chip packaging, new energy vehicles, high-speed rail and subway, wind power generation, etc. due to their outstanding performance characteristics.

BPDA monomer is one of the special monomers for the synthesis of polyimide, which makes full use of the characteristics of BPDA monomer such as heat resistance, insulation, and rigidity to be applied to the synthesis of specific polyimide materials, and is used in specific fields, such as consumer electronics cameras, motor insulation, special PI fibers, etc.